Keyphrases
Diode Laser
100%
Laser Bonding
100%
Silicon Photonic Integrated Circuits
100%
Multichannel Laser
100%
Bonding Process
62%
Photonics
25%
Irradiation
25%
Multi-channel
12%
Technology Integration
12%
Repeatability
12%
High-throughput
12%
Simultaneous Imaging
12%
Electronic System
12%
Process Integration
12%
Thermal Stress
12%
Micro-electro-mechanical Systems
12%
Power Control
12%
III-V
12%
Integration Approach
12%
Hybrid Integration
12%
Photonic Waveguide
12%
Effective Integration
12%
Bond Formation
12%
Energy Effective
12%
Photonic Circuits
12%
Automated Process
12%
Photonic Integration Technology
12%
Photonic Systems
12%
Integration Density
12%
Practical Demonstration
12%
Photonic Integration
12%
Increased Pressure
12%
Wafer-level Optics
12%
Warpage
12%
Active Waveguide
12%
III-V Optoelectronics
12%
Silicon Imaging
12%
Localized Heat
12%
Fast Alignment
12%
Overheating Protection
12%
Solder Layer
12%
Engineering
Multichannel
100%
Photonics
100%
Silicon Photonics
100%
Bonding Process
100%
Integrated Circuit
100%
Waveguide
40%
Induced Stress
20%
Power Control
20%
Repeatability
20%
Technology Integration
20%
Micro-Electro-Mechanical System
20%
Optoelectronics
20%
Integration Approach
20%
Photonic Integration
20%
Bond Formation
20%
Effective Energy
20%
Photonic Integration Technology
20%
Successful Bond
20%
Melting Point
20%
Material Science
Electronic Circuit
100%
Silicon
100%
Laser Diode
100%
Waveguide
50%
Surface (Surface Science)
50%
Density
25%
Microelectromechanical System
25%