Laser sintering of copper nanoparticles on top of silicon substrates

A. Soltani; B. Khorramdel; A. Mardoukhi; M. Mäntysalo

doi:10.1088/0957-4484/27/3/035203

Laser sintering of copper nanoparticles on top of silicon substrates

A. Soltani, B. Khorramdel, A. Mardoukhi, M. Mäntysalo

Tutkimustuotos: Artikkeli › Tieteellinen › vertaisarvioitu

34 Sitaatiot (Scopus)

148 Lataukset (Pure)

Abstrakti

This study examines the sintering of inkjet printed nanoparticle copper ink in a room environment using a laser as a high speed sintering method. Printed patterns were sintered with increasing laser scanning speed up to 400 mm s−1. The resistivities of the sintered structures were measured and plotted against the scanning speeds. Increased resistivity seems to correlate with increased scanning speed. A selections of analytical methods was used to study the differences in microstructure and composition of the sintered structures. Based on the results, no discernable difference in the microstructure was noticed between the structures sintered using 20 mm s−1 to 400 mm s−1 scanning speeds; only the structure scanned using 5 mm s−1 speed showed a vastly different microstructure and no resistivity was measurable on this structure. Compositional studies revealed that, apart from the structure scanned with 5 mm s−1 speed which contained the highest oxygen, the rest of the structures showed a steady oxygen increase with increased scanning speed.

Alkuperäiskieli	Englanti
Artikkeli	035203
Sivumäärä	5
Julkaisu	Nanotechnology
Vuosikerta	27
Numero	3
DOI - pysyväislinkit	https://doi.org/10.1088/0957-4484/27/3/035203
Tila	Julkaistu - 9 jouluk. 2015
OKM-julkaisutyyppi	A1 Alkuperäisartikkeli tieteellisessä aikakauslehdessä

Julkaisufoorumi-taso

Jufo-taso 2

!!ASJC Scopus subject areas

Electrical and Electronic Engineering

Pääsy asiakirjaan

10.1088/0957-4484/27/3/035203Lisenssi: CC BY

Laser sintering of copper nanoparticles on top of silicon substrates
Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence (http://creativecommons.org/licenses/by/3.0/). Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.
Final published version, 1,1 MBLisenssi: CC BY

http://urn.fi/URN:NBN:fi:tty-201604183808Lisenssi: CC BY

1 Jäsenyys seurassa tai verkostossa

IEC, TC 119/WG 4 Printability (Ulkoinen yksikkö)
Mäntysalo, M. (Position of trust)
2014 → 2016
Aktiviteetti: Jäsenyys seurassa tai verkostossa

34 Viittaukset
2 Konferenssiartikkeli

Inkjet printed single layer high-density circuitry for a MEMS device
Laurila, M.-M., Soltani, A. & Mäntysalo, M., 15 heinäk. 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC). IEEE, s. 968-972 5 Sivumäärä
Tutkimustuotos: Konferenssiartikkeli › Tieteellinen › vertaisarvioitu

Open access
Tiedosto
8 Sitaatiot (Scopus)

23 Lataukset (Pure)
Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon wafer
Julkaisun otsikon käännös: Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon waferSoltani, A., Kumpulainen, T. & Mäntysalo, M., 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 27-30 May 2014, Orlando, FL. IEEE, s. 1685-1689 5 Sivumäärä
Tutkimustuotos: Konferenssiartikkeli › Tieteellinen › vertaisarvioitu

8 Sitaatiot (Scopus)

Siteeraa tätä

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title = "Laser sintering of copper nanoparticles on top of silicon substrates",

abstract = "This study examines the sintering of inkjet printed nanoparticle copper ink in a room environment using a laser as a high speed sintering method. Printed patterns were sintered with increasing laser scanning speed up to 400 mm s−1. The resistivities of the sintered structures were measured and plotted against the scanning speeds. Increased resistivity seems to correlate with increased scanning speed. A selections of analytical methods was used to study the differences in microstructure and composition of the sintered structures. Based on the results, no discernable difference in the microstructure was noticed between the structures sintered using 20 mm s−1 to 400 mm s−1 scanning speeds; only the structure scanned using 5 mm s−1 speed showed a vastly different microstructure and no resistivity was measurable on this structure. Compositional studies revealed that, apart from the structure scanned with 5 mm s−1 speed which contained the highest oxygen, the rest of the structures showed a steady oxygen increase with increased scanning speed.",

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T1 - Laser sintering of copper nanoparticles on top of silicon substrates

AU - Soltani, A.

AU - Khorramdel, B.

AU - Mardoukhi, A.

AU - Mäntysalo, M.

N1 - xoa ORG=elt,0.9 ORG=mol,0.1

PY - 2015/12/9

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N2 - This study examines the sintering of inkjet printed nanoparticle copper ink in a room environment using a laser as a high speed sintering method. Printed patterns were sintered with increasing laser scanning speed up to 400 mm s−1. The resistivities of the sintered structures were measured and plotted against the scanning speeds. Increased resistivity seems to correlate with increased scanning speed. A selections of analytical methods was used to study the differences in microstructure and composition of the sintered structures. Based on the results, no discernable difference in the microstructure was noticed between the structures sintered using 20 mm s−1 to 400 mm s−1 scanning speeds; only the structure scanned using 5 mm s−1 speed showed a vastly different microstructure and no resistivity was measurable on this structure. Compositional studies revealed that, apart from the structure scanned with 5 mm s−1 speed which contained the highest oxygen, the rest of the structures showed a steady oxygen increase with increased scanning speed.

AB - This study examines the sintering of inkjet printed nanoparticle copper ink in a room environment using a laser as a high speed sintering method. Printed patterns were sintered with increasing laser scanning speed up to 400 mm s−1. The resistivities of the sintered structures were measured and plotted against the scanning speeds. Increased resistivity seems to correlate with increased scanning speed. A selections of analytical methods was used to study the differences in microstructure and composition of the sintered structures. Based on the results, no discernable difference in the microstructure was noticed between the structures sintered using 20 mm s−1 to 400 mm s−1 scanning speeds; only the structure scanned using 5 mm s−1 speed showed a vastly different microstructure and no resistivity was measurable on this structure. Compositional studies revealed that, apart from the structure scanned with 5 mm s−1 speed which contained the highest oxygen, the rest of the structures showed a steady oxygen increase with increased scanning speed.

KW - inkjet

KW - sintering

KW - Resistance

KW - Nanoparticles

U2 - 10.1088/0957-4484/27/3/035203

DO - 10.1088/0957-4484/27/3/035203

M3 - Article

SN - 0957-4484

VL - 27

JO - Nanotechnology

JF - Nanotechnology

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Laser sintering of copper nanoparticles on top of silicon substrates

Abstrakti

Julkaisufoorumi-taso

!!ASJC Scopus subject areas

Pääsy asiakirjaan

Sormenjälki

Aktiviteetit

IEC, TC 119/WG 4 Printability (Ulkoinen yksikkö)

Tutkimustuotos

Inkjet printed single layer high-density circuitry for a MEMS device

Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon wafer

Siteeraa tätä