Materials for electronics by thermal spraying

Helena Ronkainen, Ulla Kanerva, Tommi Varis, Kimmo Ruusuvuori, Erja Turunen, Jani Peräntie, Jussi Putaala, Jari Juuti, Heli Jantunen

    Tutkimustuotos: KonferenssiartikkeliTieteellinenvertaisarvioitu

    2 Sitaatiot (Scopus)

    Abstrakti

    In this paper, dielectric and conductive properties of thermally sprayed Al2O3- and Cubased coatings on steel and alumina substrates were studied. Alumina powders with nano- and micro-sized additions of Ni, NiO, TiO2, silica, and commercial glass were used in High Velocity Oxygen Fuel (HVOF) deposition. The conventional commercial copper powder and three Ag, WC and H2 -modified powders were used in Direct Write Thermal Spray (DWTS) deposition. Mixed phases of α-Al2O3 and γ-Al2O3 were found to be present in the as-deposited coatings. Sprayed alumina-based composites exhibited dielectric permittivity of 5.3-13.9 and losses of 0.002-0.178 at 1 MHz and 1 GHz while the additions tend to increase the values. Sprayed compositions with glasstype additions were found to retain α-Al2O3 crystalline phase after the deposition. Cu depositions, especially modified ones, realised by Direct Write Thermal Spray (DWTS) showed conductivity values as high as 42-56% of IACS values. The results demonstrate that ceramic and conductive coatings fabricated by thermal spray techniques show feasible properties for electrical applications, such as low-frequency components and insulation layers to be utilised in embedded 3D circuitry, in a way that is not possible through traditional manufacturing methods.

    AlkuperäiskieliEnglanti
    OtsikkoPhysical and Numerical Simulation of Materials Processing VII
    Sivut451-456
    Sivumäärä6
    Vuosikerta762
    DOI - pysyväislinkit
    TilaJulkaistu - 2013
    OKM-julkaisutyyppiA4 Artikkeli konferenssijulkaisussa
    Tapahtuma7th International Conference on Physical and Numerical Simulation of Materials Processing, ICPNS 2013 - Oulu, Suomi
    Kesto: 16 kesäk. 201319 kesäk. 2013

    Julkaisusarja

    NimiMaterials Science Forum
    Vuosikerta762
    ISSN (painettu)02555476

    Conference

    Conference7th International Conference on Physical and Numerical Simulation of Materials Processing, ICPNS 2013
    Maa/AlueSuomi
    KaupunkiOulu
    Ajanjakso16/06/1319/06/13

    !!ASJC Scopus subject areas

    • Yleinen materiaalitiede
    • Condensed Matter Physics
    • Mechanical Engineering
    • Mechanics of Materials

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