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Neuromorphic Electronics for Intelligence Everywhere: Emerging Devices, Flexible Platforms, and Scalable System Architectures

  • Kapil Bhardwaj
  • , Roshni Satheesh Babu
  • , Yuxin Xia
  • , Eva Bestelink
  • , Radu Sporea
  • , Nikos Hastas
  • , Ioannis Zeimpekis
  • , Dimitra G. Georgiadou
  • , Sayani Majumdar*
  • *Tämän työn vastaava kirjoittaja

Tutkimustuotos: Katsausartikkelivertaisarvioitu

2 Sitaatiot (Scopus)
1 Lataukset (Pure)

Abstrakti

Unprecedented advances in Artificial Intelligence (AI)-assisted automation continue to drive the demand for hardware that is significantly more scalable, compact, and energy-efficient. Neuromorphic electronics, which offers event-driven and massively parallel information handling capabilities inspired by the biological cognition, provides a compelling solution, especially as emerging device technologies now enable true in-memory computation and tightly integrated sensing capabilities far beyond what CMOS alone can achieve. To keep pace with rapid progress in AI algorithms, the discovery of new functional materials and their integration into unconventional computing architectures has become a critical research frontier. This perspective highlights the potential of various classes of device technologies for next-generation neuromorphic AI hardware, showcasing key breakthroughs in robust, flexible, and conformable device platforms. Such technologies are particularly promising for resource-constrained edge platforms, such as wearable electronics, soft robotics, and autonomous embedded sensing systems. Lastly, we discuss that circuit- and system-level design must advance alongside device innovation, including robust biasing schemes, reliable peripheral integration, and scalable architectures that can support dense neuromorphic arrays. Looking forward, the field must embrace full-stack co-optimization from materials and device physics to circuits, architectures, and learning algorithms, ultimately enabling adaptive, autonomous computing embedded seamlessly into everyday environments.

AlkuperäiskieliEnglanti
JulkaisuAdvanced Materials
DOI - pysyväislinkit
TilaE-pub ahead of print - 2026
OKM-julkaisutyyppiA2 Katsausartikkeli tieteellisessä aikakauslehdessä

Rahoitus

K.B. and S.M. acknowledge financial support from Research Council of Finland through projects IntelliSense (project no. 345068), AI4AI (project no. 350667) and Ferrari (project no. 359047). This work was partly supported through EPSRC grants EP/V002759/1, EP/R511791/1, and EP/R028559/1. D.G.G. and R.S.B. acknowledge support from the UK Multidisciplinary Centre for Neuromorphic Computing (UKRI982). D.G.G. and Y.X. thank the UKRI Future Leaders Fellowship Grant “PHOTOMEM 2” (UKRI2061) for financial support. D.G.G. also acknowledges support from HORIZON Europe Project TEAM‐NANO under grant agreement GA 101136388. I.Z. acknowledges support from the UK's Engineering and Physical Sciences Research Council project APT‐NuCOM (EP/W022931/1).

Julkaisufoorumi-taso

  • Jufo-taso 3

!!ASJC Scopus subject areas

  • Yleinen materiaalitiede
  • Mechanics of Materials
  • Mechanical Engineering

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