## Abstrakti

Many factors of heat sink, such as its size and mass, component locations, number of fins, and fan power affect heat transfer. Owing to the opposite effects of these factors on heat sink maximum temperature, we have now a multi-objective optimization problem. A typical optimization case consists of hundreds of heat sink temperature field evaluations, which would be impractical to do with CFD. Instead, we propose to combine analytical results of convection and numerical solution of conduction to address these so-called conjugated heat transfer problems. We solve heat conduction in a solid numerically using the finite volume method and tackle convection with the analytical equation of forced convection in a parallel plate channel.This model is suitable for forced and natural convection heat sinks, and we have verified its validity by comparing its results to measured data and CFD calculations. We use the model to improve two industrial examples, using a multi-objective version of the particle swarm optimization (PSO) algorithm. The first example is a forced convection heat sink composed of nine heat generating components at the base plate, and the other is a natural convection case with two components. In both cases, mass is minimized; the other criterion is maximum temperature for the forced convection case and heat sink outer volume for the natural convection case. Our method is many orders of magnitude faster than CFD. Additionally, we provide some LES results of pin fins with natural convection for further use in similar optimizations.

Alkuperäiskieli | Englanti |
---|---|

Sivut | 473-479 |

Julkaisu | Microelectronics Reliability |

Vuosikerta | 79 |

DOI - pysyväislinkit | |

Tila | Julkaistu - 2017 |

OKM-julkaisutyyppi | A1 Alkuperäisartikkeli tieteellisessä aikakauslehdessä |

## Julkaisufoorumi-taso

- Jufo-taso 1

## !!ASJC Scopus subject areas

- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Condensed Matter Physics
- Safety, Risk, Reliability and Quality
- Surfaces, Coatings and Films
- Electrical and Electronic Engineering