Qualification of Flip Chip Fluxes by Wetting Balance and Surface Insulation Resistance Tests

Julkaisun otsikon käännös: Qualification of Flip Chip Fluxes by Wetting Balance and Surface Insulation Resistance Tests

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Julkaisun otsikon käännös	Qualification of Flip Chip Fluxes by Wetting Balance and Surface Insulation Resistance Tests
Alkuperäiskieli	Englanti
Sivut	21-26
Julkaisu	Soldering and Surface Mount Technology
Vuosikerta	11
Numero	1
Tila	Julkaistu - 1999
OKM-julkaisutyyppi	A1 Alkuperäisartikkeli tieteellisessä aikakauslehdessä

Julkaisufoorumi-taso

@article{11bbf79d3912435ababb7d037c456c67,

title = "Qualification of Flip Chip Fluxes by Wetting Balance and Surface Insulation Resistance Tests",

author = "A. Tuominen and E. Ristolainen and V. Lehtinen",

note = "Contribution: organisation=ele,FACT1=1",

year = "1999",

language = "English",

volume = "11",

pages = "21--26",

journal = "Soldering and Surface Mount Technology",

issn = "0954-0911",

publisher = "Emerald",

number = "1",

}

TY - JOUR

T1 - Qualification of Flip Chip Fluxes by Wetting Balance and Surface Insulation Resistance Tests

AU - Tuominen, A.

AU - Ristolainen, E.

AU - Lehtinen, V.

N1 - Contribution: organisation=ele,FACT1=1

PY - 1999

Y1 - 1999

M3 - Article

SN - 0954-0911

VL - 11

SP - 21

EP - 26

JO - Soldering and Surface Mount Technology

JF - Soldering and Surface Mount Technology

IS - 1

ER -