@inproceedings{7fa12ae8bdad4028b1fb7596897f30f4,
title = "Reliability and Microstructural Studies of Sn-Ag-Cu Lead-Free Solder Joints in Pulse-Heated Reflow Soldering",
author = "Milad Mostofizadeh and Kati Kokko and Laura Frisk",
note = "Contribution: organisation=ele,FACT1=1<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE; Electronic Components and Technology Conference ; Conference date: 01-01-1900",
year = "2012",
doi = "10.1109/ECTC.2012.6249142",
language = "English",
isbn = "978-1-4673-1966-9",
series = "Electronic Components and Technology Conference",
publisher = "IEEE",
pages = "2613--2170",
booktitle = "IEEE 62nd Electronic Components \& Technology Conference ECTC 2012, May 29 - June 1, 2012, San Diego, California, USA",
address = "United States",
}