Reliability assessment of flip chip attachments on thick film hybrid substrate using ACF and NCF adhesives

Julkaisun otsikon käännös: Reliability assessment of flip chip attachments on thick film hybrid substrate using ACF and NCF adhesives

Tutkimustuotos: Konferenssiartikkeli › Tieteellinen › vertaisarvioitu

Julkaisun otsikon käännös	Reliability assessment of flip chip attachments on thick film hybrid substrate using ACF and NCF adhesives
Alkuperäiskieli	Englanti
Otsikko	The IMAPS Nordic Annual Conference, September 17-19, 2006, Gothenburg, Sweden
Sivut	179-183
Tila	Julkaistu - 2006
OKM-julkaisutyyppi	A4 Artikkeli konferenssijulkaisussa

Julkaisufoorumi-taso

@inproceedings{5c542fe8543740f6be2492d2e02c65e2,

title = "Reliability assessment of flip chip attachments on thick film hybrid substrate using ACF and NCF adhesives",

author = "J. Kiilunen and S. Kuusiluoma and P. Heino",

note = "Contribution: organisation=ele,FACT1=1",

year = "2006",

language = "English",

pages = "179--183",

booktitle = "The IMAPS Nordic Annual Conference, September 17-19, 2006, Gothenburg, Sweden",

}

TY - GEN

T1 - Reliability assessment of flip chip attachments on thick film hybrid substrate using ACF and NCF adhesives

AU - Kiilunen, J.

AU - Kuusiluoma, S.

AU - Heino, P.

N1 - Contribution: organisation=ele,FACT1=1

PY - 2006

Y1 - 2006

M3 - Conference contribution

SP - 179

EP - 183

BT - The IMAPS Nordic Annual Conference, September 17-19, 2006, Gothenburg, Sweden

ER -