@inproceedings{49514329bcff4b889baafa313964d715,
title = "Reliability, electrical performance and properties of solder (63/37) bumped flip chip components",
author = "P. Palm and A. Tuominen and J. M{\"a}{\"a}tt{\"a}nen and L. Uusitalo",
note = "ISSN: 0277-786X ; Ei TTKK:n nimiss{\"a}<br/>Contribution: organisation=pori etp,FACT1=1; SPIE CONFERENCE PROCEEDINGS ; Conference date: 01-01-1900",
year = "1998",
language = "English",
pages = "96--103",
editor = "S. Prasad and H.-D. Hartman and T. Tsujide",
booktitle = "Microelectronic manufacturing yield, reliability and failure analysis IV. Proceedings of SPIE, 23-24 September, 1998, Santa Clara, California, USA . SPIE Proceedings series volume 3510",
publisher = "SPIE",
address = "United States",
}