Reliability Evaluation of 3D-Package with Specific Test Structures

J. Tanskanen; T. Alander; E.O. Ristolainen

Reliability Evaluation of 3D-Package with Specific Test Structures

Julkaisun otsikon käännös: Reliability Evaluation of 3D-Package with Specific Test Structures

J. Tanskanen
, T. Alander
, E.O. Ristolainen

Tutkimustuotos: Konferenssiartikkeli › Tieteellinen › vertaisarvioitu

5 Sitaatiot (Scopus)

Julkaisun otsikon käännös	Reliability Evaluation of 3D-Package with Specific Test Structures
Alkuperäiskieli	Englanti
Otsikko	ECTC2002 The 52nd Electronic Components and Technology Conference, May 28-31, 2002, Sheraton San Diego, Hotel & Marina, San Diego, California, USA
Sivut	5 s
Tila	Julkaistu - 2002
OKM-julkaisutyyppi	A4 Artikkeli konferenssijulkaisussa

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@inproceedings{6bd7e151d6714c3bb812874034e77fd9,

title = "Reliability Evaluation of 3D-Package with Specific Test Structures",

author = "J. Tanskanen and T. Alander and E.O. Ristolainen",

note = "Contribution: organisation=ele,FACT1=1",

year = "2002",

language = "English",

pages = "5 s",

booktitle = "ECTC2002 The 52nd Electronic Components and Technology Conference, May 28-31, 2002, Sheraton San Diego, Hotel \& Marina, San Diego, California, USA",

}

TY - GEN

T1 - Reliability Evaluation of 3D-Package with Specific Test Structures

AU - Tanskanen, J.

AU - Alander, T.

AU - Ristolainen, E.O.

N1 - Contribution: organisation=ele,FACT1=1

PY - 2002

Y1 - 2002

M3 - Conference contribution

SP - 5 s

BT - ECTC2002 The 52nd Electronic Components and Technology Conference, May 28-31, 2002, Sheraton San Diego, Hotel & Marina, San Diego, California, USA

ER -