Abstrakti
This article focuses on characterization of screen printed electrical interconnects for wearable applications. The interconnects are screen printed with stretchable silver-based ink on a thermoplastic polyurethane film. By optimizing the process parameters, we were able to fabricate 200 μm line widths with spacing of 200 μm. The average sheet resistance is 36.2 m/, however a significant lot-To-lot deviation was noted. In the strain tests, half of the samples have lost conductivity when 74.1% strain is reached. The normalized resistances of the samples rise linearly to approximately 30 % strain, after which the growth rate and deviation between samples increases significantly. It was also discovered that no cracking can be found from the traces while subjected to strains under 30%.
| Alkuperäiskieli | Englanti |
|---|---|
| Otsikko | Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference |
| Kustantaja | IEEE |
| Sivut | 1650-1655 |
| Sivumäärä | 6 |
| ISBN (elektroninen) | 9781509012039 |
| DOI - pysyväislinkit | |
| Tila | Julkaistu - 16 elok. 2016 |
| OKM-julkaisutyyppi | A4 Artikkeli konferenssijulkaisussa |
| Tapahtuma | IEEE Electronic Components and Technology Conference - , Yhdysvallat Kesto: 1 tammik. 2000 → … |
Conference
| Conference | IEEE Electronic Components and Technology Conference |
|---|---|
| Maa/Alue | Yhdysvallat |
| Ajanjakso | 1/01/00 → … |
Julkaisufoorumi-taso
- Jufo-taso 1
!!ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering
Sormenjälki
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