Shear stress modeling of ACA joints in thermal tests

Kirsi Saarinen; Laura Frisk

doi:10.1109/ESimE.2012.6191715

Shear stress modeling of ACA joints in thermal tests

Julkaisun otsikon käännös: Shear stress modeling of ACA joints in thermal tests

Kirsi Saarinen
, Laura Frisk

Tutkimustuotos: Konferenssiartikkeli › Tieteellinen › vertaisarvioitu

1 Sitaatiot (Scopus)

Julkaisun otsikon käännös	Shear stress modeling of ACA joints in thermal tests
Alkuperäiskieli	Englanti
Otsikko	13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. EuroSimE 2012, April 16-18, 2012, Cascais, Portugal
Toimittajat	L.J. Ernst, G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger
Julkaisupaikka	Piscataway, NJ
Kustantaja	IEEE
Sivut	1-8
Sivumäärä	8
ISBN (elektroninen)	978-1-4673-1513-5
ISBN (painettu)	978-146731512-8
DOI - pysyväislinkit	https://doi.org/10.1109/ESimE.2012.6191715
Tila	Julkaistu - 2012
OKM-julkaisutyyppi	A4 Artikkeli konferenssijulkaisussa

Julkaisusarja

Nimi	IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Julkaisufoorumi-taso

Ei tasoa

Pääsy asiakirjaan

10.1109/ESimE.2012.6191715

Siteeraa tätä

Saarinen, K., & Frisk, L. (2012). Shear stress modeling of ACA joints in thermal tests. teoksessa L. J. Ernst, G. Q. Zhang, W. D. Van Driel, P. Rodgers, C. Bailey, & O. de Saint Leger (Toimittajat), 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. EuroSimE 2012, April 16-18, 2012, Cascais, Portugal (Sivut 1-8). (IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems). IEEE. https://doi.org/10.1109/ESimE.2012.6191715

Saarinen, Kirsi ; Frisk, Laura. / Shear stress modeling of ACA joints in thermal tests. 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. EuroSimE 2012, April 16-18, 2012, Cascais, Portugal. Toimittaja / L.J. Ernst ; G.Q. Zhang ; W.D. Van Driel ; P. Rodgers ; C. Bailey ; O. de Saint Leger. Piscataway, NJ : IEEE, 2012. Sivut 1-8 (IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems).

@inproceedings{16ffb02571a7414f8f6469363e00c935,

title = "Shear stress modeling of ACA joints in thermal tests",

author = "Kirsi Saarinen and Laura Frisk",

note = "ei ut-numeroa 29.8.2013<br/>Contribution: organisation=ele,FACT1=1<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE",

year = "2012",

doi = "10.1109/ESimE.2012.6191715",

language = "English",

isbn = "978-146731512-8",

series = "IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems",

publisher = "IEEE",

pages = "1--8",

editor = "L.J. Ernst and G.Q. Zhang and \{Van Driel\}, W.D. and P. Rodgers and C. Bailey and \{de Saint Leger\}, O.",

booktitle = "13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. EuroSimE 2012, April 16-18, 2012, Cascais, Portugal",

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Saarinen, K & Frisk, L 2012, Shear stress modeling of ACA joints in thermal tests. julkaisussa LJ Ernst, GQ Zhang, WD Van Driel, P Rodgers, C Bailey & O de Saint Leger (toim), 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. EuroSimE 2012, April 16-18, 2012, Cascais, Portugal. IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, IEEE, Piscataway, NJ, Sivut 1-8. https://doi.org/10.1109/ESimE.2012.6191715

Shear stress modeling of ACA joints in thermal tests. / Saarinen, Kirsi; Frisk, Laura.
13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. EuroSimE 2012, April 16-18, 2012, Cascais, Portugal. toim. / L.J. Ernst; G.Q. Zhang; W.D. Van Driel; P. Rodgers; C. Bailey; O. de Saint Leger. Piscataway, NJ: IEEE, 2012. s. 1-8 (IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems).

Tutkimustuotos: Konferenssiartikkeli › Tieteellinen › vertaisarvioitu

TY - GEN

T1 - Shear stress modeling of ACA joints in thermal tests

AU - Saarinen, Kirsi

AU - Frisk, Laura

N1 - ei ut-numeroa 29.8.2013<br/>Contribution: organisation=ele,FACT1=1<br/>Publisher name: Institute of Electrical and Electronics Engineers IEEE

PY - 2012

Y1 - 2012

U2 - 10.1109/ESimE.2012.6191715

DO - 10.1109/ESimE.2012.6191715

M3 - Conference contribution

SN - 978-146731512-8

T3 - IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

SP - 1

EP - 8

BT - 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. EuroSimE 2012, April 16-18, 2012, Cascais, Portugal

A2 - Ernst, L.J.

A2 - Zhang, G.Q.

A2 - Van Driel, W.D.

A2 - Rodgers, P.

A2 - Bailey, C.

A2 - de Saint Leger, O.

PB - IEEE

CY - Piscataway, NJ

ER -

Saarinen K, Frisk L. Shear stress modeling of ACA joints in thermal tests. julkaisussa Ernst LJ, Zhang GQ, Van Driel WD, Rodgers P, Bailey C, de Saint Leger O, toimittajat, 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. EuroSimE 2012, April 16-18, 2012, Cascais, Portugal. Piscataway, NJ: IEEE. 2012. s. 1-8. (IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems). doi: 10.1109/ESimE.2012.6191715