The applicability of electrodeposited photoresist in producing ultra-fine lines using sputtered seeding layers

P. Jalonen; A. Tuominen

The applicability of electrodeposited photoresist in producing ultra-fine lines using sputtered seeding layers

Julkaisun otsikon käännös: The applicability of electrodeposited photoresist in producing ultra-fine lines using sputtered seeding layers

P. Jalonen
, A. Tuominen

Tutkimustuotos: Konferenssiartikkeli › Tieteellinen › vertaisarvioitu

3 Sitaatiot (Scopus)

Julkaisun otsikon käännös	The applicability of electrodeposited photoresist in producing ultra-fine lines using sputtered seeding layers
Alkuperäiskieli	Englanti
Otsikko	EMAP 2000, Proceedings of International Symposium on Electronic Materials and Packaging, November 30 - December 2, 2000, Clear Water Bay, Kowloon
Toimittajat	J.K. Kim
Sivut	152-155
Tila	Julkaistu - 2000
OKM-julkaisutyyppi	A4 Artikkeli konferenssijulkaisussa

Julkaisufoorumi-taso

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title = "The applicability of electrodeposited photoresist in producing ultra-fine lines using sputtered seeding layers",

author = "P. Jalonen and A. Tuominen",

note = "ISBN 0-7803-6654-9<br/>Contribution: organisation=pori ttp,FACT1=1",

year = "2000",

language = "English",

isbn = "0-7803-6654-9",

pages = "152--155",

editor = "J.K. Kim",

booktitle = "EMAP 2000, Proceedings of International Symposium on Electronic Materials and Packaging, November 30 - December 2, 2000, Clear Water Bay, Kowloon",

}

The applicability of electrodeposited photoresist in producing ultra-fine lines using sputtered seeding layers. / Jalonen, P.; Tuominen, A.
EMAP 2000, Proceedings of International Symposium on Electronic Materials and Packaging, November 30 - December 2, 2000, Clear Water Bay, Kowloon. toim. / J.K. Kim. 2000. s. 152-155.

Tutkimustuotos: Konferenssiartikkeli › Tieteellinen › vertaisarvioitu

TY - GEN

T1 - The applicability of electrodeposited photoresist in producing ultra-fine lines using sputtered seeding layers

AU - Jalonen, P.

AU - Tuominen, A.

N1 - ISBN 0-7803-6654-9<br/>Contribution: organisation=pori ttp,FACT1=1

PY - 2000

Y1 - 2000

M3 - Conference contribution

SN - 0-7803-6654-9

SP - 152

EP - 155

BT - EMAP 2000, Proceedings of International Symposium on Electronic Materials and Packaging, November 30 - December 2, 2000, Clear Water Bay, Kowloon

A2 - Kim, J.K.

ER -