The Effect of Multiple Reflow Times on Lead-Free Solder Joint Microstructure

Julkaisun otsikon käännös: The Effect of Multiple Reflow Times on Lead-Free Solder Joint Microstructure

Tutkimustuotos: Konferenssiartikkeli › Tieteellinen › vertaisarvioitu

1 Sitaatiot (Scopus)

Julkaisun otsikon käännös	The Effect of Multiple Reflow Times on Lead-Free Solder Joint Microstructure
Alkuperäiskieli	Englanti
Otsikko	InterPACK'03. International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, USA, July 6-11, 2003
Sivut	10 s
Tila	Julkaistu - 2003
OKM-julkaisutyyppi	A4 Artikkeli konferenssijulkaisussa

Julkaisufoorumi-taso

@inproceedings{4e022d80663b4a0db0b9c7f63a7592a1,

title = "The Effect of Multiple Reflow Times on Lead-Free Solder Joint Microstructure",

author = "S. Nurmi and E. Ristolainen and J. Sundelin and T. Lepist{\"o}",

note = "Contribution: organisation=ele,FACT1=1",

year = "2003",

language = "English",

pages = "10 s",

booktitle = "InterPACK'03. International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, USA, July 6-11, 2003",

}

TY - GEN

T1 - The Effect of Multiple Reflow Times on Lead-Free Solder Joint Microstructure

AU - Nurmi, S.

AU - Ristolainen, E.

AU - Sundelin, J.

AU - Lepistö, T.

N1 - Contribution: organisation=ele,FACT1=1

PY - 2003

Y1 - 2003

M3 - Conference contribution

SP - 10 s

BT - InterPACK'03. International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, USA, July 6-11, 2003

ER -