The effect of roughness and pattern of the core material to adhesion in making build-up layers

P. Jalonen; A. Tuominen

The effect of roughness and pattern of the core material to adhesion in making build-up layers

Julkaisun otsikon käännös: The effect of roughness and pattern of the core material to adhesion in making build-up layers

P. Jalonen
, A. Tuominen

Tutkimustuotos: Konferenssiartikkeli › Tieteellinen › vertaisarvioitu

3 Sitaatiot (Scopus)

Julkaisun otsikon käännös	The effect of roughness and pattern of the core material to adhesion in making build-up layers
Alkuperäiskieli	Englanti
Otsikko	Advances in Electronic Materials and Packaging 2001. Proceedings of the 3rd International Symposium on Electronics Materials and Packaging 2001, November 19-22, 2001, Jeju Island, Korea
Toimittajat	S. B. Lee, K. W. Paik
Sivut	88-92
Tila	Julkaistu - 2001
OKM-julkaisutyyppi	A4 Artikkeli konferenssijulkaisussa

Julkaisufoorumi-taso

Ei tasoa

Siteeraa tätä

Jalonen, P., & Tuominen, A. (2001). The effect of roughness and pattern of the core material to adhesion in making build-up layers. teoksessa S. B. Lee, & K. W. Paik (Toimittajat), Advances in Electronic Materials and Packaging 2001. Proceedings of the 3rd International Symposium on Electronics Materials and Packaging 2001, November 19-22, 2001, Jeju Island, Korea (Sivut 88-92)

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title = "The effect of roughness and pattern of the core material to adhesion in making build-up layers",

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year = "2001",

language = "English",

pages = "88--92",

editor = "Lee, \{S. B.\} and Paik, \{K. W.\}",

booktitle = "Advances in Electronic Materials and Packaging 2001. Proceedings of the 3rd International Symposium on Electronics Materials and Packaging 2001, November 19-22, 2001, Jeju Island, Korea",

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The effect of roughness and pattern of the core material to adhesion in making build-up layers. / Jalonen, P.; Tuominen, A.
Advances in Electronic Materials and Packaging 2001. Proceedings of the 3rd International Symposium on Electronics Materials and Packaging 2001, November 19-22, 2001, Jeju Island, Korea. toim. / S. B. Lee; K. W. Paik. 2001. s. 88-92.

Tutkimustuotos: Konferenssiartikkeli › Tieteellinen › vertaisarvioitu

TY - GEN

T1 - The effect of roughness and pattern of the core material to adhesion in making build-up layers

AU - Jalonen, P.

AU - Tuominen, A.

N1 - ISBN 0-7803-7157-7<br/>Contribution: organisation=pori etp,FACT1=1

PY - 2001

Y1 - 2001

M3 - Conference contribution

SP - 88

EP - 92

BT - Advances in Electronic Materials and Packaging 2001. Proceedings of the 3rd International Symposium on Electronics Materials and Packaging 2001, November 19-22, 2001, Jeju Island, Korea

A2 - Lee, S. B.

A2 - Paik, K. W.

ER -