Thermal management materials in electronics

Thermal management materials are widely used in electronics to facilitate the conduction of heat from components to the surrounding area. This group of materials is very large, including, e.g., metal cooling elements, greases, adhesives, phase change materials, and elastic pads. These materials can replace other cooling techniques, such as fans. In many cases the material solution is preferred because heat conduction is a more effective way to manage heating problems than techniques based on convection.

In this research project, two material groups were chosen for development: heat-conductive gel composites and ceramic coatings. Both of these offer good heat conduction combined with electrical insulation.

Heat-conductive gels and gel composites can be applied on components and circuit boards that need cooling. Gels fill air gaps between hot components and cooling material, thus improving heat conduction.

Ceramic coatings can be used as heat-conducting and electrically insulating substrates in power electronics. These applications are extremely demanding due to the necessity of resistance against high temperatures, mechanical compression, and very high electrical resistance.