Thin form-factor super multiview head-up display system

Tutkimustuotos: KonferenssiartikkeliScientificvertaisarvioitu

21 Lataukset (Pure)


We propose a virtual-image head-up display (HUD) based on the super multiview (SMV) display technology. Implementation-wise, the HUD provides a compact solution, consisting of a thin form-factor SMV display and a combiner placed on the windshield of the vehicle. Since the utilized display is at most few centimeters thick, it does not need extra installation space that is usually required by most of the existing virtual image HUDs. We analyze the capabilities of the proposed system in terms of several HUD related quality factors such as resolution, eyebox width, and target image depth. Subsequently, we verify the analysis results through experiments carried out using our SMV-HUD demonstrator. We show that the proposed system is capable of visualizing images at the typical virtual image HUD depths of 2 − 3m, in a reasonably large eyebox, which is slightly over 30cm in our demonstrator. For an image at the target virtual image depth of 2.5m, the field of view of the developed system is 11x16 and the spatial resolution is around 240x60 pixels in vertical and horizontal directions, respectively. There is, however, plenty of room for improvement regarding the resolution, as we actually utilize an LCD at moderate resolution (216 ppi) and off-the-shelf lenticular sheet in our demonstrator.

OtsikkoStereoscopic Displays and Applications XXX
DOI - pysyväislinkit
TilaJulkaistu - 13 tammik. 2019
OKM-julkaisutyyppiA4 Artikkeli konferenssijulkaisussa
TapahtumaStereoscopic Displays and Applications Conference - Burlingame, Yhdysvallat
Kesto: 13 tammik. 201917 tammik. 2019


Nimi IS&T International Symposium on Electronic Imaging
ISSN (elektroninen)2470-1173


ConferenceStereoscopic Displays and Applications Conference


  • Jufo-taso 1

!!ASJC Scopus subject areas

  • Computer Graphics and Computer-Aided Design
  • Computer Science Applications
  • Human-Computer Interaction
  • Software
  • Electrical and Electronic Engineering
  • Atomic and Molecular Physics, and Optics


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