Transmission electron microscopy studies on high strength copper alloys

P. Lehtinen; V. T. Kuokkala; T. Tiainen

Transmission electron microscopy studies on high strength copper alloys

Julkaisun otsikon käännös: Transmission electron microscopy studies on high strength copper alloys

P. Lehtinen
, V. T. Kuokkala
, T. Tiainen

Tutkimustuotos: Konferenssiartikkeli › Tieteellinen

Julkaisun otsikon käännös	Transmission electron microscopy studies on high strength copper alloys
Alkuperäiskieli	Englanti
Otsikko	Proceedings of VII Finnish Conference on Physics in Industry, Finland, Tampere, November 1-2, 1995
Toimittajat	R. Hernberg, J. Saaristo
Julkaisupaikka	Tampere
Kustantaja	Tampere University of Technology
Sivut	33-36
Tila	Julkaistu - 1995
OKM-julkaisutyyppi	B3 Vertaisarvioimaton artikkeli konferenssijulkaisussa

Julkaisusarja

Nimi	Tampere University of Technology, Department of Electrical Engineering, Report
Kustantaja	Tampere University of Technology
Numero	7-95

Julkaisufoorumi-taso

Ei tasoa

Siteeraa tätä

Lehtinen, P., Kuokkala, V. T., & Tiainen, T. (1995). Transmission electron microscopy studies on high strength copper alloys. teoksessa R. Hernberg, & J. Saaristo (Toimittajat), Proceedings of VII Finnish Conference on Physics in Industry, Finland, Tampere, November 1-2, 1995 (Sivut 33-36). (Tampere University of Technology, Department of Electrical Engineering, Report; Nro 7-95). Tampere University of Technology.

Lehtinen, P. ; Kuokkala, V. T. ; Tiainen, T. / Transmission electron microscopy studies on high strength copper alloys. Proceedings of VII Finnish Conference on Physics in Industry, Finland, Tampere, November 1-2, 1995. Toimittaja / R. Hernberg ; J. Saaristo. Tampere : Tampere University of Technology, 1995. Sivut 33-36 (Tampere University of Technology, Department of Electrical Engineering, Report; 7-95).

@inproceedings{acef6348d294400cbe19e9fd619ddafc,

title = "Transmission electron microscopy studies on high strength copper alloys",

author = "P. Lehtinen and Kuokkala, \{V. T.\} and T. Tiainen",

note = "Contribution: organisation=mol elm,FACT1=1",

year = "1995",

language = "English",

series = "Tampere University of Technology, Department of Electrical Engineering, Report",

publisher = "Tampere University of Technology",

number = "7-95",

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editor = "R. Hernberg and J. Saaristo",

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Lehtinen, P, Kuokkala, VT & Tiainen, T 1995, Transmission electron microscopy studies on high strength copper alloys. julkaisussa R Hernberg & J Saaristo (toim), Proceedings of VII Finnish Conference on Physics in Industry, Finland, Tampere, November 1-2, 1995. Tampere University of Technology, Department of Electrical Engineering, Report, Nro 7-95, Tampere University of Technology, Tampere, Sivut 33-36.

Transmission electron microscopy studies on high strength copper alloys. / Lehtinen, P.; Kuokkala, V. T.; Tiainen, T.
Proceedings of VII Finnish Conference on Physics in Industry, Finland, Tampere, November 1-2, 1995. toim. / R. Hernberg; J. Saaristo. Tampere: Tampere University of Technology, 1995. s. 33-36 (Tampere University of Technology, Department of Electrical Engineering, Report; Nro 7-95).

Tutkimustuotos: Konferenssiartikkeli › Tieteellinen

TY - GEN

T1 - Transmission electron microscopy studies on high strength copper alloys

AU - Lehtinen, P.

AU - Kuokkala, V. T.

AU - Tiainen, T.

N1 - Contribution: organisation=mol elm,FACT1=1

PY - 1995

Y1 - 1995

M3 - Conference contribution

T3 - Tampere University of Technology, Department of Electrical Engineering, Report

SP - 33

EP - 36

BT - Proceedings of VII Finnish Conference on Physics in Industry, Finland, Tampere, November 1-2, 1995

A2 - Hernberg, R.

A2 - Saaristo, J.

PB - Tampere University of Technology

CY - Tampere

ER -

Lehtinen P, Kuokkala VT, Tiainen T. Transmission electron microscopy studies on high strength copper alloys. julkaisussa Hernberg R, Saaristo J, toimittajat, Proceedings of VII Finnish Conference on Physics in Industry, Finland, Tampere, November 1-2, 1995. Tampere: Tampere University of Technology. 1995. s. 33-36. (Tampere University of Technology, Department of Electrical Engineering, Report; 7-95).