Undercut edges for robust capillary self-alignment in hybrid microassembly

Ville Liimatainen; Veikko Sariola; Quan Zhou

doi:10.1109/NEMS.2013.6559911

Undercut edges for robust capillary self-alignment in hybrid microassembly

Ville Liimatainen, Veikko Sariola, Quan Zhou

Tutkimustuotos: Konferenssiartikkeli › Scientific › vertaisarvioitu

4 Sitaatiot (Scopus)

Abstrakti

In this paper, we report capillary self-alignment of 200 μm × 200 μm square parts on matching patterns with undercut edges. The undercut edge structure is a purely topographical feature that provides ultimate pinning for liquids of any surface tension without chemical treatment. We show contact angles close to 180° for low surface tension liquids, and capillary self-alignment using thermally curable adhesive. Sub-micron alignment accuracy after adhesive curing is verified in a scanning electron microscope (SEM).

Alkuperäiskieli	Englanti
Otsikko	8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013
Sivut	1088-1091
Sivumäärä	4
DOI - pysyväislinkit	https://doi.org/10.1109/NEMS.2013.6559911
Tila	Julkaistu - 2013
OKM-julkaisutyyppi	A4 Artikkeli konferenssijulkaisussa
Tapahtuma	8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013 - Suzhou, Kiina Kesto: 7 huhtik. 2013 → 10 huhtik. 2013

Conference

Conference	8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013
Maa/Alue	Kiina
Kaupunki	Suzhou
Ajanjakso	7/04/13 → 10/04/13

!!ASJC Scopus subject areas

Biochemistry, Genetics and Molecular Biology (miscellaneous)
Biotechnology

Pääsy asiakirjaan

10.1109/NEMS.2013.6559911

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Siteeraa tätä

@inproceedings{7ad5d9f8537e40a3bfef21f82a51e721,

title = "Undercut edges for robust capillary self-alignment in hybrid microassembly",

abstract = "In this paper, we report capillary self-alignment of 200 μm × 200 μm square parts on matching patterns with undercut edges. The undercut edge structure is a purely topographical feature that provides ultimate pinning for liquids of any surface tension without chemical treatment. We show contact angles close to 180° for low surface tension liquids, and capillary self-alignment using thermally curable adhesive. Sub-micron alignment accuracy after adhesive curing is verified in a scanning electron microscope (SEM).",

keywords = "microassembly, microfabrication, self-alignment, surface tension, wetting",

author = "Ville Liimatainen and Veikko Sariola and Quan Zhou",

year = "2013",

doi = "10.1109/NEMS.2013.6559911",

language = "English",

isbn = "9781467363525",

pages = "1088--1091",

booktitle = "8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013",

note = "8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013 ; Conference date: 07-04-2013 Through 10-04-2013",

}

Liimatainen, V, Sariola, V & Zhou, Q 2013, Undercut edges for robust capillary self-alignment in hybrid microassembly. julkaisussa 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013., 6559911, Sivut 1088-1091, 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013, Suzhou, Kiina, 7/04/13. https://doi.org/10.1109/NEMS.2013.6559911

TY - GEN

T1 - Undercut edges for robust capillary self-alignment in hybrid microassembly

AU - Liimatainen, Ville

AU - Sariola, Veikko

AU - Zhou, Quan

PY - 2013

Y1 - 2013

N2 - In this paper, we report capillary self-alignment of 200 μm × 200 μm square parts on matching patterns with undercut edges. The undercut edge structure is a purely topographical feature that provides ultimate pinning for liquids of any surface tension without chemical treatment. We show contact angles close to 180° for low surface tension liquids, and capillary self-alignment using thermally curable adhesive. Sub-micron alignment accuracy after adhesive curing is verified in a scanning electron microscope (SEM).

AB - In this paper, we report capillary self-alignment of 200 μm × 200 μm square parts on matching patterns with undercut edges. The undercut edge structure is a purely topographical feature that provides ultimate pinning for liquids of any surface tension without chemical treatment. We show contact angles close to 180° for low surface tension liquids, and capillary self-alignment using thermally curable adhesive. Sub-micron alignment accuracy after adhesive curing is verified in a scanning electron microscope (SEM).

KW - microassembly

KW - microfabrication

KW - self-alignment

KW - surface tension

KW - wetting

UR - http://www.scopus.com/inward/record.url?scp=84883063217&partnerID=8YFLogxK

U2 - 10.1109/NEMS.2013.6559911

DO - 10.1109/NEMS.2013.6559911

M3 - Conference contribution

AN - SCOPUS:84883063217

SN - 9781467363525

SP - 1088

EP - 1091

BT - 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013

T2 - 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013

Y2 - 7 April 2013 through 10 April 2013

ER -

Undercut edges for robust capillary self-alignment in hybrid microassembly

Abstrakti

Conference

!!ASJC Scopus subject areas

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